TECHNET Archives

August 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 14 Aug 1998 10:16:43 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
There can be immersion Lead, but not electroless.

The difference is that immersion plating does a substitution of the metal in
solution, in this case Lead, for whatever the substrate is, say Copper.  The
implications are that immersion plating stops when the substrate is completely
covered, and thus tends to be thin, but also can be more uniform, and pore
free than electroless, at least for a given thickness of metal.

Ain't a whole lot of development work going on these days on Lead plating, but
we have some skeletons in our closet.  What metal do you want to plate on too?

Why not contact me directly, and not via Technet.

Rudy Sedlak
RD Chemical Company
Mountain View CA
phone 650-962-8004
fax 650-962-0370

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2