Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 12 Aug 1998 18:21:52 -0400 |
Content-Type: | text/plain |
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Conformal coatings are not encapsulation materials. See IPC T-50 for
the proper terminology and definitions. A conformal coating is not an
encapsulate.
what are you looking for?
Al Cash
> ----------
> From: Hogue, Pat (AZ76)[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;Hogue, Pat (AZ76)
> Sent: Wednesday, August 12, 1998 6:10 PM
> To: [log in to unmask]
> Subject: Re: [TN] The ideal eletronic encapsulation material?
>
> Uralane 5750 (Ciba) and Parylene C (Du Pont) meet most of these
> requirements as conformal coatings.
>
> ----------
> From: Jan Satterfield [SMTP:[log in to unmask]]
> Sent: Wednesday, August 12, 1998 2:10 PM
> To: [log in to unmask]
> Subject: Re: [TN] The ideal eletronic encapsulation material?
>
> I think everyone would like to know the answer to this one! If
> anyone
> does, please share the response on TechNet!
>
> >-----Original Message-----
> >From: Edward Boucher [SMTP:[log in to unmask]]
> >Sent: Wednesday, August 12, 1998 2:49 PM
> >To: [log in to unmask]
> >Subject: [TN] The ideal eletronic encapsulation material?
> >
> >Greetings Technet,
> >
> > Dose anyone know of a encapsulating material for electronics, which
> can
> >meet the majority of these parameters? We have been searching for
> about a
> >year and have had little success.
> >
> >The Ideal Encapsulation Material
> >
> >a. low toxicity
> >b. low moisture permeability
> >c. no or very low ionic content
> >d. low viscosity
> >e. low linear shrinkage
> >f. low glass transition temperature (Tg)
> >g. low Coefficient Of Expansion (CTE)
> >h. low embedment stress
> >i. high tensile strength
> >j. high thermal conductivity
> >k. void free
> >l. electrical insulation properties
> >m. thermal cycling stability
> >n. high thermal shock resistance
> >o. wide temperature range -55 to 95 degrees C
> >p. good chemical and solvent resistance
> >q. good adhesion
> >r. low cost
> >s. ease of processing (application and clean up)
> >t. no formation of water
> >u. non-corrosive
> >v. easily repairable
> >
> >
> >Your help is appreciated...
> >
> >Ed Boucher
> >Engineering R&D Tech.
> >K and M Electronics
> >413-263-6253
> >
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