hi,
from an applied coating point of view, it's hard to beat the protection
provided by paraxylylene (by the way, it isn't available from dupont but
from specialty coating systems/union carbide where it is known as
parylene and from an italian co. where it is known as galxyl). however,
from an application point of view it is not for the faint of heart. it
doesn't adhere well to some solder masks, it requires some very careful
masking, it requires special application equipment, and thus it is more
expensive.
phil crepeau
-----Original Message-----
From: Hogue, Pat (AZ76) [mailto:[log in to unmask]]
Sent: Wednesday, August 12, 1998 3:10 PM
To: [log in to unmask]
Subject: Re: [TN] The ideal eletronic encapsulation material?
Uralane 5750 (Ciba) and Parylene C (Du Pont) meet most of these
requirements as conformal coatings.
----------
From: Jan Satterfield [SMTP:[log in to unmask]]
Sent: Wednesday, August 12, 1998 2:10 PM
To: [log in to unmask]
Subject: Re: [TN] The ideal eletronic encapsulation material?
I think everyone would like to know the answer to this one! If
anyone
does, please share the response on TechNet!
>-----Original Message-----
>From: Edward Boucher [SMTP:[log in to unmask]]
>Sent: Wednesday, August 12, 1998 2:49 PM
>To: [log in to unmask]
>Subject: [TN] The ideal eletronic encapsulation material?
>
>Greetings Technet,
>
> Dose anyone know of a encapsulating material for electronics, which
can
>meet the majority of these parameters? We have been searching for
about a
>year and have had little success.
>
>The Ideal Encapsulation Material
>
>a. low toxicity
>b. low moisture permeability
>c. no or very low ionic content
>d. low viscosity
>e. low linear shrinkage
>f. low glass transition temperature (Tg)
>g. low Coefficient Of Expansion (CTE)
>h. low embedment stress
>i. high tensile strength
>j. high thermal conductivity
>k. void free
>l. electrical insulation properties
>m. thermal cycling stability
>n. high thermal shock resistance
>o. wide temperature range -55 to 95 degrees C
>p. good chemical and solvent resistance
>q. good adhesion
>r. low cost
>s. ease of processing (application and clean up)
>t. no formation of water
>u. non-corrosive
>v. easily repairable
>
>
>Your help is appreciated...
>
>Ed Boucher
>Engineering R&D Tech.
>K and M Electronics
>413-263-6253
>
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