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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 12 Aug 1998 15:10:29 -0600 |
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I think everyone would like to know the answer to this one! If anyone
does, please share the response on TechNet!
>-----Original Message-----
>From: Edward Boucher [SMTP:[log in to unmask]]
>Sent: Wednesday, August 12, 1998 2:49 PM
>To: [log in to unmask]
>Subject: [TN] The ideal eletronic encapsulation material?
>
>Greetings Technet,
>
> Dose anyone know of a encapsulating material for electronics, which can
>meet the majority of these parameters? We have been searching for about a
>year and have had little success.
>
>The Ideal Encapsulation Material
>
>a. low toxicity
>b. low moisture permeability
>c. no or very low ionic content
>d. low viscosity
>e. low linear shrinkage
>f. low glass transition temperature (Tg)
>g. low Coefficient Of Expansion (CTE)
>h. low embedment stress
>i. high tensile strength
>j. high thermal conductivity
>k. void free
>l. electrical insulation properties
>m. thermal cycling stability
>n. high thermal shock resistance
>o. wide temperature range -55 to 95 degrees C
>p. good chemical and solvent resistance
>q. good adhesion
>r. low cost
>s. ease of processing (application and clean up)
>t. no formation of water
>u. non-corrosive
>v. easily repairable
>
>
>Your help is appreciated...
>
>Ed Boucher
>Engineering R&D Tech.
>K and M Electronics
>413-263-6253
>
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