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August 1998

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Subject:
Re: Solder paste printing
From:
sahmad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Aug 1998 16:29:54 -0600
Content-Type:
text/plain
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Volume inversely proportional to squeegee speed and pressure.
Syed.

        -----Original Message-----
        From:   Vincent B. Kinol [SMTP:[log in to unmask]]
        Sent:   Friday, August 07, 1998 10:50 AM
        To:     [log in to unmask]
        Subject:        [TN] Solder paste printing

        I'm looking for articles on printing, with respect to solder paste
volume
        fill of apertures. I have received questions with respect to paste
density,
        volume on pad, and its relation to fill volume of stencil. If anyone
can
        suggest articles or books I would appreciate any information.
                Thanks

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