On 30 Aug 98 at 4:02, Raymond Lee wrote:
> Dear sir,
> I'm facing some SMT solder defect problem. The major
> defect
> I'm facing is solder short(solder bridging). I would like to know
> what are the factors contibute to this defect and solutions to
> overcome this type of problem. I hope to hear from you!
This can have millions of reasons, but first you should be
more specific: which SMT packages, reflow/wave
solder, temperature profile, PCB surface (solder mask), if reflow,
which solder paste (RMA, no clean..), solder paste stencils
(undersized or 1:1 or special shapes) or dispensing........, if wave
solder, orientation of the SMT devices, conveyor speed, solder
temperature.........
Regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://home.t-online.de/home/matthias.mansfeld
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