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Wed, 26 Aug 1998 08:28:15 -0700 |
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Jeremy-
A Mayo Packaging web page mentions-
"...single layer and metalization (SLAM) alumina..."
from site-
http://www.mayo.edu/sppdg/packaging_development.html
But I suspect this isn't what you're looking for.
SLAM may be one on the many CSP acronyms, but don't have the right
references on hand.
YOU WROTE...
------------------------------
Date: Wed, 26 Aug 1998 14:25:45 +0000
From: Jeremy Drake <[log in to unmask]>
Subject: slam package?
Anyone in Technet land heard of slam electronic packages? I can't find
them
as a JEDEC outline. Do they exist? What are they?
regards, Jeremy Drake
Celestica
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