Jeremy-
A Mayo Packaging web page mentions-
"...single layer and metalization (SLAM) alumina..."
from site-
http://www.mayo.edu/sppdg/packaging_development.html
But I suspect this isn't what you're looking for.
SLAM may be one on the many CSP acronyms, but don't have the right
references on hand.
YOU WROTE...
------------------------------
Date: Wed, 26 Aug 1998 14:25:45 +0000
From: Jeremy Drake <[log in to unmask]>
Subject: slam package?
Anyone in Technet land heard of slam electronic packages? I can't find
them
as a JEDEC outline. Do they exist? What are they?
regards, Jeremy Drake
Celestica
------------------------------
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################