TECHNET Archives

August 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Subject:
Re: PCB Pad Strength
From:
"Kelly M. Schriver" <[log in to unmask]>
Date:
Fri, 21 Aug 1998 07:18:38 -0500
X-To:
[log in to unmask]
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (23 lines) 
Kathy -

IPC-4101 should give you a pretty good idea of both the test conditions and
peel strength for your copper foil on your specific laminate.  Your specific
laminate manufacturer could also assist, if you require more precise
information.  Note that shear and tensile are not tests normally performed at
the laminate material level.  IPC-MF-150 will provide tensile, hardness and
elongation data for most foils.

Regards - Kelly

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2