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August 1998

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From:
Mark Pozorski <[log in to unmask]>
Date:
Tue, 18 Aug 1998 16:32:15 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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     Rob, Isn't HASL a wonder thing!   We deal with the same thing every

     day!  HASL is, in my opinion,  a very "gothic" technology with a lot

     of short comings especially process controllability! The only cure I

     see is using a different PCB finish.  This is also on our to-do list!



     Mark P

     ADC Telecom.







     ______________________________ Reply Separator
     _________________________________

     Subject: [TN] PC Board Surface Mount Solderability

     Author:  "TechNet E-Mail Forum." <[log in to unmask]>           Rob
     Carrillo

     <[log in to unmask]> at Internet-Mail

     Date:    8/18/98 3:34 PM





     Is there a standard for planarity and thickness of surface mount pads.
     Many

     of boards received exhibit uneven HAL, yet meet MIL-PRF-55110F. As a

     result, the side of the pad with the thinner solder coat exhibits
     advanced

     stages of intermetallic growth. How do we, as an end user control this
     with

     our supplier base?



     Regards,

     Rob Carrillo

     Supplier Quality Engineer





     Electronic Systems Division

     Aerospace Group

     Parker Hannifin Corp.

     300 Marcus Blvd.

     Smithtown, NY 11787

     Tel: (516) 231-3737 X2049

     Fax: (516) 348-1592

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