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Tue, 18 Aug 1998 15:34:17 -0400 |
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Is there a standard for planarity and thickness of surface mount pads. Many
of boards received exhibit uneven HAL, yet meet MIL-PRF-55110F. As a
result, the side of the pad with the thinner solder coat exhibits advanced
stages of intermetallic growth. How do we, as an end user control this with
our supplier base?
Regards,
Rob Carrillo
Supplier Quality Engineer
Electronic Systems Division
Aerospace Group
Parker Hannifin Corp.
300 Marcus Blvd.
Smithtown, NY 11787
Tel: (516) 231-3737 X2049
Fax: (516) 348-1592
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