We are struggling a bit with footprint with on fine pitch devices (20 mil
pitch).  IPC recommends 12 mils +/- 2 mils which doesn't leave much room
between the pads to prevent bridging.  However, I have read numerous
articles and spoken with various manufacturers that are spec'ing between
11-13 mils.  What I would like to find out is what is common practice with
respect to this.  Especially interested in the board finish being used with
the call out and the tolerances on the spec called out.  We currently use 10
mils +/- 1.5 mils, but are in the process of increasing to 11 mils +/- 1.5
mils.  What do you think?

Thanks in advance!

Chad Thibodeau
EF Data
Component Engineer
602 333-2138 Phone
602 921-9012 Fax
[log in to unmask]

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