I have a question?
Why if you plate a panel with NiAu then you do a
tape test prior to your etch process and at that
point the Au passes the test. After you etch the
panel it then fails the tape test, now one more
thing if you bake the panel at 300 F for one hour
then do another tape test now you pass. So my
question is should you always bake NiAu, or is
that just a fix on a problem that we have with
are plating process? Last thing guys when I say
that it fails the tape test it is the adhesion
between the NiAu. Any imput would be appreciated.


Dave Blevins

Modular Components National, Inc.
2302 Industry Court
Forest Hill, MD 2150
PH (410) 879-6553
Fax (410) 838-7629

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