LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

August 1998

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET August 1998

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Condense Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Sender:	TechNet <[log in to unmask]>
X-To:	"Louis, Edwin" <[log in to unmask]>
Date:	Wed, 12 Aug 1998 07:05:03 -0700
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, Michael Carano <[log in to unmask]>
Subject:	Re: Soldering to Electroless Nickel Plating
From:	Michael Carano <[log in to unmask]>
Content-Transfer-Encoding:	7bit
Content-Type:	text/plain; charset=us-ascii
Organization:	ec
MIME-Version:	1.0
Parts/Attachments:	text/plain (39 lines)

Louis, Edwin wrote:
>
>        WE have a situation where some electroless nickel plated items
> that
>      come in from a vendor are some times solderable with RMA flux and
>      other times requires an organic acid flux to do the job.
>        Someone told us that the phosphorus content may make the
> difference
>      and someone else suggested that included organics may cause this.
> Any
>      comments or experiences with this.
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################Edwin,
All of the above suggestions are possibilities.
One other possibility is the tendency for any nickel deposit to passivate
readily, thus making the deposit difficult to solder.
Can you suggest putting a flash deposit of gold down to help?

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2

LISTSERV.IPC.ORG