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August 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 1 Sep 1998 10:26:42 +0800
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Lum Wee Mei <[log in to unmask]>
Subject:
Bubbles from conformally coated board
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Organization:
DSO National Laboratories
From:
Lum Wee Mei <[log in to unmask]>
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text/plain (22 lines) 
The test engineer came back to us to complain that bubbles are found
along the edge of the power modules after going through the temperature
cycling tests. This problems are found on both coated boards. The power
modules are mounted completely flushed onto the board and subject to
conformal coating using the diping method. The coated board undergo QC
to ensure all components are completely coated, inlcuding the edges
around the modules.

What could be the problem?

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