Technetters:

For the first time, I've been handed a 20 mil pitch, 208 Pin QFP socket from
our engineering group. I know that for some of you, this device and lead
pitch is a "Piece 'o cake". For me, this appears to be a mighty difficult
challenge. I have a few questions that I need help with:

1) Is this part processed just like 50 mil pitch ?? (Screen print, place,
reflow)
2) Can this part be placed by hand?  Will the surface tension of the molten
solder "Center" the component like it does with 50 mil pitch?
3) Any ideas on how to do a quickie run for 1 (208 Pin QFP) socket on a
circuit board so that development testing can start ?

Any  other inputs  would be appreciated.

Thanks in advance.

Bill Kasprzak
Moog Inc.
716-652-2000 ext 2507
[log in to unmask]

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