TECHNET Archives

August 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Date:
Sat, 29 Aug 1998 22:28:11 +0200
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Matthias Mansfeld <[log in to unmask]>
Content-transfer-encoding:
7BIT
Content-type:
text/plain; charset=US-ASCII
Subject:
Re: solder defect
From:
Matthias Mansfeld <[log in to unmask]>
MIME-Version:
1.0
In-Reply-To:
<[log in to unmask]>
Organization:
Matthias Mansfeld Elektronik
Comments:
Authenticated sender is <[log in to unmask]>
Parts/Attachments:
text/plain (39 lines) 
On 30 Aug 98 at 4:02, Raymond Lee wrote:

> Dear sir,
>             I'm facing some SMT solder defect problem. The major
>             defect
> I'm facing is solder short(solder bridging). I would like to know
> what are the factors contibute to this defect and solutions to
> overcome this type of problem. I hope to hear from you!

This can have millions of reasons, but first you should be
more specific: which SMT packages, reflow/wave
solder, temperature profile, PCB surface (solder mask), if reflow,
which solder paste (RMA, no clean..), solder paste stencils
(undersized or 1:1 or special shapes) or dispensing........, if wave
solder, orientation of the SMT devices, conveyor speed, solder
temperature.........

Regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://home.t-online.de/home/matthias.mansfeld

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2