Currently, I am also working on writing procedure on handling all SMDs.
I would appreciate info on this.

thanks



> ----------
> From:         Neal W Driscoll[SMTP:[log in to unmask]]
> Sent:         August 27, 1998 8:57 AM
> To:   [log in to unmask]
> Subject:      [TN] Handling Moisture Sensitive Components
>
> Technetters,
>
> This is a follow up to an earlier e-mail I sent out concerning the
> handling
> of moisture sensitive components.  I have gotten some information
> concerning the issue and I am now trying to find out what
> processes/methods
> other electronic manufactures are using to address handling moisture
> sensitive components from receiving, to the stock room, to the
> manufacturing floor (SMD area).  Are people strictly re-packaging and
> issuing the parts?  Are nitrogen storage cabinets being used?  Are
> people
> skipping all handling precautions and just baking prior to SMD?  What
> are
> others doing????
>
>
> Any information would be appreciated.  Thanks.
>
>
> Neal Driscoll
>
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