We are repackaging the left overs packages after use. Al cladded bags
with dessicator puches are used . staorage in nitrogen cabinet without
supply of nitrogen. Since wpg weather keeps floor humidity low, we have
not seen any case of popcorning on FPDs even with exposure over one
week.

We do respect the standards and are  planning to use nitrogen supply ,
however, nitrogen cylinders and associated problems with nitrogen
cylinders are major hinderances. I came across one vendor to supply dry
nitrogen generated from compressed air line. I am waiting for details.
Anybody using cylinderless nitrogen system for this application i.e.
storing MS component??


Ashok Dhawan P.ENG.
Manufacturing Engineering
Unisys Canada Inc.
51 Burmac Road
Winnipeg R2J4C9
CANADA
Fone 204-257-9199
Fax   204-257-9104


> ----------
> From:         Collins, Graham[SMTP:[log in to unmask]]
> Sent:         August 27, 1998 9:02 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Handling Moisture Sensitive Components
>
> Neal
> We typically do not do a receiving inspection on moisture sensitive
> parts
> (unless previous history says we should), the parts are issued to the
> line
> in original packaging.  If not all used after opening we store them in
> a
> nitrogen cabinet.
> The other twist we have is that since we build small batches we often
> end up
> buying parts from distributors who may or may not have opened the
> packaging
> to split up lots of parts.  In that case we typically bake before use
> and
> again store unused parts in the cabinet.
>
> regards,
>
> Graham Collins
> Process Engineer
> Litton Systems Canada
> (902) 873-2000 extension 215
>
> -----Original Message-----
> From: Neal W Driscoll [mailto:[log in to unmask]]
> Sent: Thursday, August 27, 1998 10:58 AM
> To: [log in to unmask]
> Subject: [TN] Handling Moisture Sensitive Components
>
>
> Technetters,
>
> This is a follow up to an earlier e-mail I sent out concerning the
> handling
> of moisture sensitive components.  I have gotten some information
> concerning the issue and I am now trying to find out what
> processes/methods
> other electronic manufactures are using to address handling moisture
> sensitive components from receiving, to the stock room, to the
> manufacturing floor (SMD area).  Are people strictly re-packaging and
> issuing the parts?  Are nitrogen storage cabinets being used?  Are
> people
> skipping all handling precautions and just baking prior to SMD?  What
> are
> others doing????
>
>
> Any information would be appreciated.  Thanks.
>
>
> Neal Driscoll
>
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