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July 1998

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Subject:
Re: IPC HOLE TO LEAD RATIOS
From:
"Hurst, Joe" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Jul 1998 08:35:17 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (49 lines) 
Rich:

                I don't know where it came from, but it works very well.

Joe Hurst

> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Tuesday, June 30, 1998 8:01 PM
> To:   [log in to unmask]
> Subject:      [TN] IPC HOLE TO LEAD RATIOS
>
>      Could someone enlighten me on how the hole to lead ratios for through
>      hole technology was derived in IPC-D-275?
>
>      Specifically, does it;
>         consider automated placement or manual insertion?
>         consider hand assembly, wave solder, reflow solder, or any?
>
>      Thank you very much, Rich.
>
>      [log in to unmask]  -  NEW ADDRESS!
>
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