TECHNET Archives

July 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Copper Stains on suface of Au Fingers
From:
Ryan Jennens <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Tue, 7 Jul 1998 11:29:52 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
Doug-

    Is it possible that the copper is diffusing into the gold and that a
nickel (or similar) barrier is required between the copper and gold?
Just a thought...

Ryan

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2