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July 1998

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Subject:
From:
Eddie Brunker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 7 Jul 1998 15:42:10 +0100
Content-Type:
text/plain
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text/plain (25 lines)
At 07:18 07/07/98 -0700, you wrote:
>  REGARDING           [TN] etch factor
>
>What is typical etch factor for 1oz Cu these days? What about 2oz? What is a
>common trace-space that suppliers see these days? Thanks.
>

May I extend that question from the assembly point of view...
and ask what overall reduction is seen on pads and traces on 1/2 oz outer layer?
Due not only to etching but also because of collimation?? tolerance.

Thanks

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