In a message dated 7/6/98 11:26:51 AM Pacific Daylight Time,
[log in to unmask] writes:

> We are manufacturing Class 2 PWAs that are not being delivered to
>       Telcos or RBOCs.  We have found nothing in IPC specifications
>       regarding the following.
>
>       Question:  When attaching three components for which there are no
>       solderable pads, is it acceptable to use RTV to "goop the heck"
>       (official technical term) out of the repair?
>
>       What is a more acceptable method?

Hi John!

     It depends on what the component is, and how susceptable it is to taking
enough of a hit where needs securing down. I've used RTV before, and my
official term is; "Slather the bejeebers out of it..." (GRIN) I've also used
double-sided tape (foam-backed or regular), and hot melt glue. I stay away
from Tak-pak and the like...doesn't hold good enough and looks like poop (but
RTV ain't all that great in the looks department either...)

-Steve Gregory-

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