We have tried that, but apparently (this CCA is being built at an
outside contractor), the component sits too high off the PWB for a good
center solder connection, so the design engineer would like me to
research conductive epoxies.  Know of any?

>----------
>From:  Chan, Marcelo[SMTP:[log in to unmask]]
>Reply To:      "TechNet E-Mail Forum." <[log in to unmask]>,"Chan, Marcelo"
>Sent:  Monday, July 06, 1998 9:55 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] ASSY: Thermally/Electrically Conductive Epoxy
>
>can't you provide an stencil aperture for the component underside and use
>solder
>for that interconnection so as to not add a dispensing process to your
>process
>flow...if done correctly, you should not have any intermittent
>connections...some of the  problems with using conductive adhesives are CTE
>mismatches, depending on the paste you may have issues with rosin residues,
>forming adequate fillets around the component and probably most
>important...rework!
>
>Marcelo
>
>        -----Original Message-----
>        From:   Jan Satterfield [SMTP:[log in to unmask]]
>        Sent:   Monday, July 06, 1998 11:30 AM
>        To:     [log in to unmask]
>        Subject:        [TN] ASSY: Thermally/Electrically Conductive Epoxy
>
>        We have an RF component that contains a metal pad on the underside of
>        the component that is soldered to a pad on the pwb.  After reflow we
>are
>        getting intermittent connections.  I need to find a thermally and
>        electrically conductive epoxy that I can use to bond the metal pad to
>        the pwb and will then withstand the temperatures of reflow while the
>        leads are soldered.  This epoxy will need to be applied with a
>dispenser
>        due to high volume.
>
>        Any suggestions or vendors that I might contact?
>
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