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July 1998

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Mon, 6 Jul 1998 14:15:19 -0600
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     We are manufacturing Class 2 PWAs that are not being delivered to
     Telcos or RBOCs.  We have found nothing in IPC specifications
     regarding the following.

     Question:  When attaching three components for which there are no
     solderable pads, is it acceptable to use RTV to "goop the heck"
     (official technical term) out of the repair?

     What is a more acceptable method?

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