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July 1998

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Subject:
From:
"Chan, Marcelo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Jul 1998 11:55:31 -0400
Content-Type:
text/plain
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text/plain (53 lines)
can't you provide an stencil aperture for the component underside and use solder
for that interconnection so as to not add a dispensing process to your process
flow...if done correctly, you should not have any intermittent
connections...some of the  problems with using conductive adhesives are CTE
mismatches, depending on the paste you may have issues with rosin residues,
forming adequate fillets around the component and probably most
important...rework!

Marcelo

        -----Original Message-----
        From:   Jan Satterfield [SMTP:[log in to unmask]]
        Sent:   Monday, July 06, 1998 11:30 AM
        To:     [log in to unmask]
        Subject:        [TN] ASSY: Thermally/Electrically Conductive Epoxy

        We have an RF component that contains a metal pad on the underside of
        the component that is soldered to a pad on the pwb.  After reflow we are
        getting intermittent connections.  I need to find a thermally and
        electrically conductive epoxy that I can use to bond the metal pad to
        the pwb and will then withstand the temperatures of reflow while the
        leads are soldered.  This epoxy will need to be applied with a dispenser
        due to high volume.

        Any suggestions or vendors that I might contact?

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