We have an RF component that contains a metal pad on the underside of
the component that is soldered to a pad on the pwb. After reflow we are
getting intermittent connections. I need to find a thermally and
electrically conductive epoxy that I can use to bond the metal pad to
the pwb and will then withstand the temperatures of reflow while the
leads are soldered. This epoxy will need to be applied with a dispenser
due to high volume.
Any suggestions or vendors that I might contact?
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################