Hi,TechNetters!
While trying to improve the solder joint quality of low profile smt
metal case crystals,
and trying to overcome the Alloy 42 impediments, I came upon a footnote
in
J-STD-001B which gave me some hope, if I understood it well.
Par.9.2.6.3. Round or flattened (coined) leads-Note 1:....Solder should
not
extend under the body of low profile surface mount components whose
leads
are made of Alloy 42 or similar metals.
Does this mean that the solder joint should extend outwards and that the
pads
should not extend inward up to the base of the leads?
Are the component manufacturers aware of this-if true-when they
recommend
the footprint?
What is your experience in this matter?
Thank you,
Gaby

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