I would think it wise to address the problem from a chemistry standpoint
or use an alternate surface finish before going the electroplated Nickel
route.  You will immediately either alienate or disqualify most of your
PCB suppliers.  Using electroplate requires surface continuity (unless
you're fortunate enough to have a design that is internally bussed, very
unlikely!)  so you're generally forced to do a body plate prior to
surface cu foil etch,  This most likely would entail the inclusion of an
electrolytic gold flash as well because the nickel would be difficult if
not impossible to re-activate if you were trying to utilize an immersion
gold process later on.  Not only will line definition suffer,  you run
the risk of  nickel slivers after etch, and lastly I doubt most profit
margins  will warrant the additional expense of body plated gold!!

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