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July 1998

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Subject:
Phosphorous content of electroless Ni
From:
Hütter Simon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Jul 1998 07:59:24 +0100
Content-Type:
text/plain
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text/plain (29 lines) 
Hello Techneters.

I have heard that the phosphorous content of electroless Ni
should be more than 10% to avoid microcracks in the Ni
under the Au. Also it should be better for wire bonding.

But on the other hand it must be less then 10% for a good solderability
(discussed here before).

Our electroless Ni/Au has a P content of 8-10%. And the supplier says
that this is perfect for soldering and wire-bonding.

Can anyone help me out of this?

Thanks
Simon

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