Earl Moon wrote:

> It has recently, and disruptively, been brought to my past ignorant
> attention the problem associated with electroless nickel deposition
> under electroless gold deposited SMT solder termination areas. I have
> been informed, by a major BGA supplier, the deposition process relies
> on
> phosphorous as a component in the plating solution. Further, I have
> been
> told this is detrimental to solder joint formation.
>
> It is said, and has been proven by the BGA supplier, that phosphorous
> causes solder joint problems by forming an internetallic that, over
> time, causes embrittlement. Therefore, solder joints fail.
>
> Has anyone in industry addressed this issue from a PCB fabrication
> standpoint? If so - how, and what is being done? Can we specify
> electroplated nickel in approximately 100 millionths thickness as for
> electroless types? If so, will this overcome the intermetallic,
> embrittlement, and solder joint problem?
>
> Thanks, Earl Moon
>
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   Hi, TechNetters!
Earl Moon refers to BGA joints . What about all the SMD joints?
Did Pandora again open her box?
Gaby

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