Paul Klasek wrote:
> I concur with David ; have been watching this discussion for some time
>
> and kept out as I thought perhaps I'm the odd one out in extreme as
> usual ; but since Dave cracked the pot the way it is :
> If the process is out of window to such a degree this kind of
> machinery
> is needed ;
> I'd say $ much better spend would be in the process gear ; not
> inspection gear .
> The ICT ( I know , not exactly a process gear ; but touch more useful
> than XR ) is certainly much more inquisitive about the actual status
> (working) not just visual with gross limitations and price tag .
> Therefore design for test ; stable process and ICT will get you
> through
> with much greater degree ( checking the chip at the same time [you
> don't
> need to if it's Rockwell]) of assurance and miles cheaper as well ;
> than if you really want to know (we're in relative extreme now) have
> the
> bed of nails pad clamped to board in enviro chamber and watch few
> cycles
> on event detector , not one dry joint escapes ; than you have your SPC
>
> base ; on the way to functional future .
> Presuming the life tests of your particular process (cycling) has been
>
> done ; therefore process verified .
> Dave's method of establishing the process with XR and monitor on ICT
> is
> fine if you can justify the expense ;
> however if you use ICT locate the fault and than perform a series of
> cross sections as you tune the process you won't go broke and on top
> you
> have nice validation on hand .
>
> Thanks Dave ;
>
> Paul Klasek
> http://www.resmed.com
>
> > ----------
> > From: David D
> Hillman[SMTP:[log in to unmask]]
> > Sent: Thursday, 30 July 1998 23:16
> > To: [log in to unmask]
> > Subject: Re: [TN] Glenbrook x-ray??
> >
> > Hi Rick - the introduction of the ball grid array type package has
> > created
> > an opportunity that I think many assemblers are missing: an
> > opportunity to
> > use test rather than visual inspection to judge the quality of a
> > processed
> > assembly. I am currently evaluating the Glenbrook MINIRTX system and
>
> > am
> > quite happy with it. However, the system is not powerful enough to
> > "see"
> > opens or poor wetting. I have been using the system as a tool to
> > establish
> > process control - we look for shorts, misalignments, stray solder
> > balls,
> > etc. on a sampling basis and then use electrical test to verify
> > functionality. We also have done some minor metallographic
> > cross-sectioning
> > to confirm reflow profiles, cleaning, etc. You can find some very
> > capable
> > xray equipment that will find all the defects of interest (within
> > reason,
> > no bonfires please) but these equipments come with a pricetag. One
> > alternative is to use a combination of lower capability xray systems
>
> > and
> > electrical test. Good Luck.
> >
> > Dave Hillman
> > Rockwell Collins
> > [log in to unmask]
> >
> >
> >
> >
> >
> > Rick Thompson <[log in to unmask]> on 07/29/98
> 01:27:43
> > PM
> >
> > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> > respond
> > to Rick Thompson <[log in to unmask]>
> >
> > To: [log in to unmask]
> > cc:
> > Subject: [TN] Glenbrook x-ray??
> >
> >
> >
> >
> > Hi,
> >
> > We're starting to look into x-ray systems, specifically for BGA
> > inspection.
> > Units by Glenbrook caught my attention due to their low cost
> relative
> > to
> > other units on the market. Anybody have any feedback, positive or
> > negative
> > on their products?
> >
> > I'd also appreciate any other insight you might care to share
> > regarding
> > other vendors and BGA X-ray.
> >
> > Thanks.
> >
> > Rick Thompson
> > Ventura Electronics Assembly
> >
> > ################################################################
> > TechNet E-Mail Forum provided as a free service by IPC using
> LISTSERV
> > 1.8c
> > ################################################################
> > To subscribe/unsubscribe, send a message to [log in to unmask] with
> > following
> > text in the body:
> > To subscribe: SUBSCRIBE TechNet <your full name>
> > To unsubscribe: SIGNOFF TechNet
> > ################################################################
> > Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> > section
> > for additional information.
> > For technical support contact Hugo Scaramuzza at [log in to unmask] or
> > 847-509-9700 ext.312
> > ################################################################
> >
> > ################################################################
> > TechNet E-Mail Forum provided as a free service by IPC using
> LISTSERV
> > 1.8c
> > ################################################################
> > To subscribe/unsubscribe, send a message to [log in to unmask] with
> > following text in the body:
> > To subscribe: SUBSCRIBE TechNet <your full name>
> > To unsubscribe: SIGNOFF TechNet
> > ################################################################
> > Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> > section for additional information.
> > For technical support contact Hugo Scaramuzza at [log in to unmask] or
> > 847-509-9700 ext.312
> > ################################################################
> >
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
Hi, Paul!
Doing cross sections on one or more assemblies in real time is a tough
job!
I speak from the "artists" point of view, of course.
I prefer to do an X-ray, determine if it's worth, decide which samples
are representative for the test, and then start the cumbersome
mechanical procedure which takes a lot of time, until finally , in 2-3
minutes I can see the root of the problem.
If your product doesn't change much and you already established the
right parameters,
you are right.
Not everybody is that lucky or has a cross section lab next door.
Gaby
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
