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July 1998

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Subject:
From:
"Leslie O. Connally" <[log in to unmask]>
Reply To:
Leslie O. Connally
Date:
Fri, 31 Jul 1998 10:52:17 -0700
Content-Type:
text/plain
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text/plain (59 lines)
Earl & Joseph,

I'm not sure what the answer is, but most of the electrolytic Nickel I know of
also contain Phosphorus. Perhaps the answer is in a thicker or electrolytic
Gold.

I'll be interested in the resolution to this one.

Regards,
Les Connally

>  From: Earl Moon <[log in to unmask]>, on 7/31/98 8:19 AM:
>  Joseph,
>
>  I just asked a question concerning phosphorous intermetallic growth as
>  in item 16 or so. I was prompted to do so because of a response I
>  received some weeks ago concerning the issue you raise.
>
>  Again, a major BGA supplier (Motorola) wrote me and confided they found
>  the problem associated with their sphere attachment to a substrate using
>  the immersion tin and gold processes. To make a long story short,
>  someone, at some time dropped a board on the floor detaching BGA devices
>  at all their termination points.
>
>  My question to industry is what can we do to overcome the phosphorous
>  intermetallic and resulting solder joint embrittlement problem? Can we
>  go to electroplated nickel in required thicknesses and then deposit
>  electroless gold over that?
>
>  Earl Moon
>
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