John Sater wrote:
>
> Hello all:
>
> We are going to evaluate a new type of liquid applicable primary etch
> resist. Unlike commonly used resists, this one swells in the developer
> solution and requires a mild scrubbing action to be completely
> removed. Moreover, it is detached as flakes, very much like in the
> stripper.
>
> My question to all: Is anyone aware of developing machine that can
> scrub the resist off the panel and also remove the flakes to avoid
> redeposition on the panel? Our search so far yielded nothing and we
> suspect that we might need a custom built machine.
>
> Thanks,
>
> J. Sater
>
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 To
John Sater,
 This happens as residual s/m or dry film foot print or scum.
Assuming that you have nice control over exposure,developing, and
characterstics of material that you are using on consitent base,

This problem can be controlled by
1. Using high pressure rinse
2. Light micro-etch and high pressure rinse
3. Usning alumina-jet scrubber
4. Using acid cleaner and micro-etch
 This is somewhat maerginal problem  and can be controlled easily.
Wish you best of LUCK
  Fulabhai Patel
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