Hi Jeff
Always thought that closeness of SMD components to scorelines was a much
neglected subject. In another life I had some bad bad experiences with
this.
This question can be treated as simple as an educated guess or as
complex as measuring substrate deflection at snap off. Component
orientation also matters.
A good place to start is the usually neglected fact that scoring depth
(=breakoff force) can vary wildely without proper process control.

Wolfgang / Viasystems Canada

> ----------
> From:         Jeff Hempton[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Jeff Hempton
> Sent:         Thursday, July 30, 1998 4:12 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Scoring
>
>      BTW Mark,
>        I notice that there are no references to guidelines for
> closeness of
>      SMD components to V-score edge..any feedback from the industry or
>      feelings for this subject you would like to share
> (please,please).
>        How about anyone else out there?
>      Regards & Thanx!
>
>      Jeff Hempton
>      United Technologies Electronic Controls
>
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