I just received a new assignment from my manager to come up with a list
of spec. for inspecting BAG components using X ray machine after the
part is placed on the PCB.    I want to know that if there is an
industry standard already exists in the market, are there any on line
articles that talk about the subject and if anyone  will willing to
share his/her knowledge with me.    My second question is that is it
possible to inspect BGA on a double sided assembly....if the answer is
yes, then what are the areas I need to watch out for?

Thank you for your time to view my message.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################