Hi Rick - the introduction of the ball grid array type package has created
an opportunity that I think many assemblers are missing: an opportunity to
use test rather than visual inspection to judge the quality of a processed
assembly. I am currently evaluating the Glenbrook MINIRTX system and am
quite happy with it. However, the system is not powerful enough to "see"
opens or poor wetting. I have been using the system as a tool to establish
process control - we look for shorts, misalignments, stray solder balls,
etc. on a sampling basis and then use electrical test to verify
functionality. We also have done some minor metallographic cross-sectioning
to confirm reflow profiles, cleaning, etc.  You can find some very capable
xray equipment that will find all the defects of interest (within reason,
no bonfires please) but these equipments come with a pricetag. One
alternative is to use a combination of lower capability xray systems and
electrical test. Good Luck.

Dave Hillman
Rockwell Collins
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Rick Thompson <[log in to unmask]> on 07/29/98 01:27:43 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Rick Thompson <[log in to unmask]>

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cc:
Subject:  [TN] Glenbrook x-ray??




Hi,

We're starting to look into x-ray systems, specifically for BGA inspection.
Units by Glenbrook caught my attention due to their low cost relative to
other units on the market.  Anybody have any feedback, positive or negative
on their products?

I'd also appreciate any other insight you might care to share regarding
other vendors and BGA X-ray.

Thanks.

Rick Thompson
Ventura Electronics Assembly

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