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July 1998

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Subject:
From:
"Collins, Graham" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Jul 1998 10:21:50 -0300
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Steve
A CGA is like a BGA but with a column of hi-temp solder instead of the ball.
My understanding of it is that it gives the package more flexibility so that
you have less failures (due to CTE differences) compared to a BGA.  For high
I/O count devices on (for example) a ceramic body it makes sense to use a
CGA, perhaps that's why your customer is considering it.  I'm not sure how
it would be viewed as more manufacturable.

There are several papers on CGA in the proceedings from SMI '97.

regards,

Graham Collins
Process Engineer
Litton Systems Canada
(902) 873-2000 extension 215

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, July 30, 1998 10:45 AM
To: [log in to unmask]
Subject: [TN] Column Grid Arrays


All,

Maybe I just too new to this SMT thing, but can someone clue me in on what
exactly a column grid array device is?  I have been presented with a
proposed
build to print project that according to our customer may use column grid
array
devices instead of BGA's to "enhance manufacturability".

Thanks in advance of your support!!

Steve McBride
Frontier Electronic Systems Corp.
[log in to unmask]

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