Jim-
This one reference, of many available, comes to mind since it's on my
desk, open to the flip chip section:
Chap 8, "Chip-to-Package Interconnections", of text "Microelectronics
Packaging Handbook", Volume II ("Semiconductor Packaging"), 2nd Edition
(1997), Editors Rao Tummala, Eugene Rymaszewski, and Alan Klopfenstein";
Chapter 8 Authors are Paul Totta-IBM, Subash Khadpe-STC, Nicholas
Koopman-MCNC, Timothy Reiley-IBM, and Michael Sheaffer-Kulicke & Soffa.
--57 pages in the chapter cover flip chip history and technology,
especially Section 8.3. One of the flip chip references at the end of
the Chapter was co-authored by Totta in 1971! A good intro to flip chip.
ALSO- See numerous papers on flip chip solder and underfill mechanics,
reliability, etc., in last 2 or 3 years of ASME's Journal of Electronic
Packaging.
(For example, "Two Test Specimens for Determining the Interfacial
Fracture Toughness in Flip-Chip Assemblies", ASME Jour. Elec. Pkg.,
Vol.120, No.2, June 1998, p.150)
Good luck.
-Michael Alderete
You wrote...
------------------------------
Date: Wed, 29 Jul 1998 15:38:00 -0400
From: Jim Marsico 516-595-5879 <[log in to unmask]>
Subject: assy: flip chip
Looking for books, papers, etc., on flip chip technology. Anything from
basics
to advanced processes.
Thanks,
Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]
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