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July 1998

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Subject:
Re: assy: flip chip
From:
Bill Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Jul 1998 13:34:14 -0700
Content-Type:
text/plain
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text/plain (62 lines) 
Best references I know of are from John Lau- Flip Chip Technologies
(ISBN 0-07-036609-8) and Solder Joint Reliability of BGA, CSP, Flip Chip
and Fine Pitch SMT Assemblies (ISBN 0-07-036648-9). Both of these are
available from Computer Literacy Bookstore (www.clbooks.com)

> *********************************
> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
> ********************************
>
>
>
> -----Original Message-----
> From: Jim Marsico 516-595-5879 [SMTP:[log in to unmask]]
> Sent: Wednesday, July 29, 1998 12:38 PM
> To:   [log in to unmask]
> Subject:      [TN] assy: flip chip
>
> Looking for books, papers, etc., on flip chip technology.  Anything
> from basics
> to advanced processes.
>
> Thanks,
>
> Jim Marsico
> AIL Systems Inc.
> (516) 595-5879
> [log in to unmask]
>
>
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