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July 1998

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Subject:
From:
Sean Heffernan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Jul 1998 13:01:43 -0700
Content-Type:
text/plain
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text/plain (72 lines)
Rick,
Here at Quadrus we are using the Hewlett Packard 5DX, although quite
expensive, it especially inspects BGA very well.  The system is able to
divide each ball into 3 (up to 5) seperate measurements.  We check for
voiding, insufficient solder, excessive solder, bridging, misalignment
as well as missing balls, all automatically and in-line straight out of
reflow.  Gullwing, jleads, caps, resistor, pcaps etc. all get inspect
extremely quickly and automated. For boards with 5000 solder joints can
be inspected in less than 2 minutes (top and bottom) and a report will
be printed to alert t/u operator the exact ref. des. as well as pin
number.  This will cut down on the amount of time and money for Q.C and
manually inspecting hard to see solder joints.  Any other questions are
welcome off-line.

Thanks,
Sean M. Heffernan
Quadrus Manufacturing
[log in to unmask]
408/918-5132

> -----Original Message-----
> From: Rick Thompson [SMTP:[log in to unmask]]
> Sent: Wednesday, July 29, 1998 11:28 AM
> To:   [log in to unmask]
> Subject:      [TN] Glenbrook x-ray??
>
> Hi,
>
> We're starting to look into x-ray systems, specifically for BGA
> inspection.
> Units by Glenbrook caught my attention due to their low cost relative
> to
> other units on the market.  Anybody have any feedback, positive or
> negative
> on their products?
>
> I'd also appreciate any other insight you might care to share
> regarding
> other vendors and BGA X-ray.
>
> Thanks.
>
> Rick Thompson
> Ventura Electronics Assembly
>
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