I've been having problems on my rigid-flex boards recently. Are there
guidelines (IPC, perhaps) governing flex baking? I'm very interested to hear
what people have to say about this problem.

Matt Sanders

Matthew Sanders
PWB Procurement Engineer, Trimble Navigation Limited
[log in to unmask]
Phone: (408) 481-7817
Fax: (408) 481-8590

> -----Original Message-----
> From: Melanie Racuya [SMTP:[log in to unmask]]
> Sent: Monday, July 27, 1998 12:07 PM
> To:   [log in to unmask]
> Subject:      [TN] delamination
>
> Hello technetters !!!
> Hope you all had a nice weekend . . .
> I'm not sure if I'm the only one encountering this kind of problem
> since nobody answered my first question regarding my problem on
> delamination on FPC's.
> I had series of evaluations performed to qualify the effect of
> pre-baking in the elimination of delamination of FPC's  but to no
> avail. A colleague of mine said that one of the causes of this is the
> moisture embedded/trapped in between the FPC layers which then
> causes such delamination when subjected to heat (reflow). Pre-baking
> is needed to evaporize the moisture so that when it reaches the
> reflow station, moisture is already gone and no delamination will
> then be created/contributed  at the reflow station. But this
> explanation proved me wrong. In the series of my evaluations,
> delamination still occured (even with the raw FPC's) at the reflow
> station.
> Please, I need your ideas about this one ...
> Thanks in advance and have a nice week ahead of you...
>
> Bing
>
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