Hello technetters !!!
Hope you all had a nice weekend . . .
I'm not sure if I'm the only one encountering this kind of problem
since nobody answered my first question regarding my problem on
delamination on FPC's.
I had series of evaluations performed to qualify the effect of
pre-baking in the elimination of delamination of FPC's  but to no
avail. A colleague of mine said that one of the causes of this is the
moisture embedded/trapped in between the FPC layers which then
causes such delamination when subjected to heat (reflow). Pre-baking
is needed to evaporize the moisture so that when it reaches the
reflow station, moisture is already gone and no delamination will
then be created/contributed  at the reflow station. But this
explanation proved me wrong. In the series of my evaluations,
delamination still occured (even with the raw FPC's) at the reflow
station.
Please, I need your ideas about this one ...
Thanks in advance and have a nice week ahead of you...

Bing

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