Hello sir,
I have only a little bit experience on hot bar soldering to shear the idea
with you. At the first all you have to concern are;
1. The M/C parameter are Reflow temp, Reflow time (setting detail depend
on your . Verify your solder, flux, PCB technical data you use and run the
experiment to optimize your best parameter, run your job at the low/high
setting of both parameters concerning to the technical data, inspect the
solder quality and analyze the trend then you can get the optimize zone to
set your M/C. Next, you can fine turn your parameter again by running as
the same method but scope the high/low setting to the zone you got from the
previous experiment. If you can not inspect the solder joint by visual the
pull test is the good way you can do, measure the bond strength force.
2. Fixturing. Fixture to firmly carry the unit for hot bar reflowing.
3. Hot bar leveling. This is important thing to consider, you can make a
block gage to setup the hot bar level to the module.
4. Fluxing, fluxing can make you prefer the solder quality.
Next, aftre running you have to involve the following issues.
1. Hot bar wearing, the ceramic hot bar can break easier than metal with
titanium plated and more expensive too.
2. Raw mat'l problem such as un-leveling of your PCB pad. The thermal
conductive elastic tape can help, use this one between the unit and hot bar
the heat can transfer to every pads.
3. Hot bar cleaning. If the flux is involved in your process then hot bar
cleaning is required. Run the M/C and set the cleaning schedule for
production. The hot bar cleaner chemical is suggested to use.
Some thing wrong please accept my apology. Unclear information please do
not hesitate to contact me.
Good luck,
Noppadol S.
At 13:16 20/7/98 +1200, you wrote:
>Hello everyone,
>
>Who out there knows anything about hot bar soldering?? We are
>considering using an LCD with a TAB driver that requires hot bar
>soldering to the PCB. The problem is I have no experience with this
>process - can anyone please explain to me what is involved, and what
>the pros and cons of using such a process are?
>
>Thanks very much.
>
>Regards,
>
>
>Bruce Robertson
>Production Engineering
>Mobile Radio Division
>Tait Electronics Ltd.
>------------------------------------------------------
>558 Wairakei Road, PO Box 1645
>Christchurch, New Zealand.
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>Email: [log in to unmask] Internet: http://www.tait.co.nz
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