Dear sir,
        Please try pre heating the module before dispensing and keep warm during
dispensing, this will allow the epoxy to seek into every nook and corner.
The other method is spraying the IPA onto the epoxy surface before go to
the oven, IPA will out gassing the epoxy by reduce the surface tension but
please be reminded your product should not have the contact
surface/connector adjoint to the epoxy because the epoxy can flow to the
connector and will insulate your product functional.
        Good luck.

With best regards,
Noppadol S.


At 11:05 29/6/98 +0000, you wrote:
>Hi everyone,
>
>I am using an epoxy dispensing machie that performs potting on metal
>scases. One of my biggest problem is the occurrence of bubbles after
>dispensing.
>The machine has its own vacuum for the chemicals before mixing. But
>the dispensing stage is done on room parameters. Bubbles occur before
>and after oven curing.
>Can this occurrence of bubbles be controlled? Or to we need a vacuum
>verger during dispense?
>
>I would also like to ask for the standard soldering iron temperature
>used for rigid PCBs and flex PCBs.
>
>
> Regards.
>
>Jon Cruz
>OIC Supervising Product Engineer
>Electronic Assemblies Inc.
>[log in to unmask]
>tel.# 823-7317/7593884
>fax# 8238326
>
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