My company is historically involved in military programs but in the
     last 5 or so years we have made a change to many more commercial
     product lines. We are using more plastic parts both for commercial and
     military customers as I suspect many other companies are also doing.

        The question from Components Reliability Engineering is about the
     practice of using chipbonder to attach surface mount plastic parts to
     a through hole PWB which is then inverted and sent through wave solder
     thereby soldering the through hole and SM components simultaneously.
     The plastic parts have been baked but CRE is concerned about latent
     damage to the dunked plastic parts. There is no damage to the external
     package but what about the inside?

        Any insight to the inside of a component and reliability from
     TechNet is appreciated.

     Stu Korringa
     Smiths Industries
     Grand Rapids, Michigan

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