Joel,

Just when you think you know it all :>), someone comes up with something
new. If you are panel plating, where does the border come from and where
are the circuits?

Joel Fillion wrote:
>
> Hello Dick,
>
> It is definitely possible.  However, it is extremely important to properly
> control plating parameters that effect plating distribution.  Also,
> depending on how well you control the process, you may have to use
> excessive border around the panel to isolate the circuits from your high
> current density area (robbers).
>
> Good Luck
>
> At 11:13 AM 7/22/98 EDT, you wrote:
> >Technetters
> >
> > Is it possible to produce 5/5 technology with a panel plate tent and etch
> > process ?  Also, what are the strengths and weaknesses of horizontal plating
> >processes ?  Can anyone provide me with info on horizontal electro plating ?
> > Thanks for your help
> >
> >Dick Desrosiers

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