TECHNET Archives

July 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jul 1998 16:41:02 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Dear Technetters,

I am gathering information on modeling services/consultancy on electronic
packages mainly PBGAs, flip chips etc. for future collaborations with my
company. If you provide these services or can refer someone, please let me
know. It is preferred that a web address be provided if available.

Regards,

Yuan Li
Packaging Engineer
Altera Corp.
(408)544-7508
Fax (408) 544-6419

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2