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July 1998

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Subject:
From:
"Muhammad, Masdi" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jul 1998 16:16:00 -0700
Content-Type:
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        We are trying to reduce the number of units fail at system test due
to
flux on gold finger.  We know so far that the flux is deposited onto the
goldfinger during touch-up or rework and to reduce the contamination we are
planning to implement 'taping' the gold finger during touch up.  Need some
advice on what kind of tape we should use or is there any other simpler
solution
that we can implement.

Appreciate the help.

Masdi

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