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July 1998

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From:
IPC TechNet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jul 1998 12:06:05 -0700
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You can also try Panel-Strike plating and follow up with pattern plate.
There's many various terminolgy but the method is basically the same.

Process Steps:
Electroless Copper
Panel-Strike Plate
O/L photo for pattern plate
Pattern plate

The key is to control:
Cu weight foil to start
How much Cu to strike plate
How much Cu to Pattern Plate

Other variables:
How much and type of auto-theiving pads to use inside and/or outside of
the actual board.
Copper bath control, i.e. anode placement, asf, etc...

Hope this helps,

Steven

>>> Ed Cosper <[log in to unmask]> 07/22/98 09:08am >>>
Hi Dick,

Personally I do not feel 5/5 technology can be produced with any kind of
acceptable yield using standard panel plating techniques. I guess if a
very thin base foil were to be used such as 1/4 oz or less it would
improve the capability but I  have never seen it done and I'm not sure if
the foil is readily available. Another concern would I would have would
be the tenting of
via holes. I would suspect that the 5/5 lines and spacing are a result of
increased surface mount devices on the part. If this were the case then
it would stand to reason that the hole to pad ratio would also be reduced.
I really personally would be very cautious about attempting to tent as an
etch resist an annular rings of .005 or less.

Just my thoughts.

Ed Cosper

----------
From:  Dick Desrosiers[SMTP:[log in to unmask]]
Sent:  Wednesday, July 22, 1998 10:13 AM
To:  [log in to unmask]
Subject:  [TN] Plating

Technetters

 Is it possible to produce 5/5 technology with a panel plate tent and etch
 process ?  Also, what are the strengths and weaknesses of horizontal
plating
processes ?  Can anyone provide me with info on horizontal electro
plating ?
 Thanks for your help

Dick Desrosiers

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